期刊簡(jiǎn)介預(yù)計(jì)審稿時(shí)間：

Structure and Bonding is a publication which uniquely bridges the journal and book format. Organized into topical volumes, the series publishes in depth and critical reviews on all topics concerning structure and bonding. With over 50 years of history, the series has developed from covering theoretical methods for simple molecules to more complex systems.

Topics addressed in the series now include the design and engineering of molecular solids such as molecular machines, surfaces, two dimensional materials, metal clusters and supramolecular species based either on complementary hydrogen bonding networks or metal coordination centers in metal-organic framework materials (MOFs). Also of interest is the study of reaction coordinates of organometallic transformations and catalytic processes, and the electronic properties of metal ions involved in important biochemical enzymatic reactions.

《結(jié)構(gòu)與鍵合》是一本獨(dú)特地將期刊和書籍形式結(jié)合起來(lái)的出版物。該系列分為專題卷，發(fā)表有關(guān)結(jié)構(gòu)和鍵合的所有主題的深入和批判性評(píng)論。該系列已有 50 多年的歷史，從涵蓋簡(jiǎn)單分子的理論方法發(fā)展到更復(fù)雜的系統(tǒng)。

該系列中討論的主題現(xiàn)在包括分子固體的設(shè)計(jì)和工程，例如基于互補(bǔ)氫鍵網(wǎng)絡(luò)或金屬有機(jī)骨架材料 (MOF) 中的金屬配位中心的分子機(jī)器、表面、二維材料、金屬簇和超分子物種。同樣令人感興趣的是有機(jī)金屬轉(zhuǎn)化和催化過(guò)程的反應(yīng)坐標(biāo)研究，以及參與重要生化酶促反應(yīng)的金屬離子的電子特性。

《Structure And Bonding》(結(jié)構(gòu)與粘合)編輯部通訊方式為SPRINGER-VERLAG BERLIN, HEIDELBERGER PLATZ 3, BERLIN, GERMANY, D-14197。如果您需要協(xié)助投稿或潤(rùn)稿服務(wù)，您可以咨詢我們的客服老師。我們專注于期刊咨詢服務(wù)十年，熟悉發(fā)表政策，可為您提供一對(duì)一投稿指導(dǎo)，避免您在投稿時(shí)頻繁碰壁，節(jié)省您的寶貴時(shí)間，有效提升發(fā)表機(jī)率，確保SCI檢索（檢索不了全額退款）。我們視信譽(yù)為生命，多方面確保文章安全保密，在任何情況下都不會(huì)泄露您的個(gè)人信息或稿件內(nèi)容。